The HEX 04 is the latest addition to the Jenoptik´s Micro Engineering line of hot embossing / nano imprinting systems. In addition to the standard features found on the HEX 03, this production worthy machine features a highly automated substrate handling system resulting in 1-3 minute cycle times and the ability to emboss larger substrates up to 300 mm thus significantly increasing the device throughput above that of currently available machines such as the HEX 03.
In addition, the HEX 04 uses Micro Engineering 's proprietary Active De-Embossing Technology that ensures an effective and defect free separation of the embossing mold from the substrate. This result minimizes stress induced in the substrate, reducing the separation time as well as providing process uniformity. Maximum temperature range of the chamber is 300 degrees C with an option to achieve 500 decrees C. Chamber temperature stability is +/- 1 degree C that enables extremely precise control of this most critical element of the process.
The use of the optional UV curing accessory provides enhanced capabilities, especially when high volume imprinting of nanometer scale features is required.
The HEX 04 is compatible with a wide range of polymer substrates including Polymethayl Methacrylatl (PMMA), Polycarbonate (PC), Polyether Imide (PEI), Polytetraflouroethylene (PTFE/Teflon) and Polyetheretherketone (PEEK) thus increasing its flexibility in the manufacturing process.
